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1

Prevention of relapse/recurrence in major depression by mindfulness-based cognitive therapy.

Teasdale, John D., Segal, Zindel V., Williams, J. Mark G., Ridgeway, Valerie A., Soulsby, Judith M., Lau, Mark A.

Journal:

Journal of Consulting and Clinical Psychology

Year:

2000

Language:

english

File:

PDF, 1.01 MB

english, 2000

2

Mortality in single fathers compared with single mothers and partnered parents: a population-based cohort study

Chiu, Maria, Rahman, Farah, Vigod, Simone, Lau, Cindy, Cairney, John, Kurdyak, Paul

Journal:

The Lancet Public Health

Year:

2018

Language:

english

File:

PDF, 525 KB

english, 2018

3

Machine Learning and Human Factors: Status, Applications, and Future Directions

Lau, Nathan, Fridman, Lex, Borghetti, Brett J., Lee, John D.

Journal:

Proceedings of the Human Factors and Ergonomics Society Annual Meeting

Year:

2018

Language:

english

File:

PDF, 4.25 MB

english, 2018

4

Fan-Out Wafer-Level Packaging for Heterogeneous Integration

Lau, John H., Li, Ming, Qingqian, Margie Li, Chen, Tony, Xu, Iris, Yong, Qing Xiang, Cheng, Zhong, Fan, Nelson, Kuah, Eric, Li, Zhang, Tan, Kim Hwee, Cheung, Yiu-Ming, Ng, Eric, Lo, Penny, Kai, Wu, Ha

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2018

Language:

english

File:

PDF, 5.55 MB

english, 2018

5

Stanley: The robot that won the DARPA Grand Challenge

Sebastian Thrun, Mike Montemerlo, Hendrik Dahlkamp, David Stavens, Andrei Aron, James Diebel, Philip Fong, John Gale, Morgan Halpenny, Gabriel Hoffmann, Kenny Lau, Celia Oakley, Mark Palatucci, Vaugha

Journal:

Journal of Field Robotics

Year:

2006

Language:

english

File:

PDF, 3.40 MB

english, 2006

6

Recent Advances and Trends in Fan-Out Wafer/Panel-Level Packaging

Journal:

Journal of Electronic Packaging

Year:

2019

Language:

english

File:

PDF, 3.52 MB

english, 2019

7

Recent Advances and New Trends in Flip Chip Technology

Journal:

Journal of Electronic Packaging

Year:

2016

Language:

english

File:

PDF, 19.83 MB

english, 2016

8

Chip-First Fan-Out Panel-Level Packaging for Heterogeneous Integration

Ko, Cheng-Ta, Yang, Henry, Lau, John H., Li, Ming, Li, Margie, Lin, Curry, Lin, J. W., Chen, Tony, Xu, Iris, Chang, Chieh-Lin, Pan, Jhih-Yuan, Wu, Hsing-Hui, Yong, Qing Xiang, Fan, Nelson, Kuah, Eric,

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2018

Language:

english

File:

PDF, 5.12 MB

english, 2018

9

First prenatal diagnosis of the carnitine transporter defect

Christodoulou, John, Teo, Siak Hong, Hammond, Judith, Sim, Keow Giak, Hsu, Betty Y.L., Stanley, Charles A., Watson, Brian, Lau, K.C., Wilcken, Bridget

Journal:

American Journal of Medical Genetics

Year:

1996

Language:

english

File:

PDF, 406 KB

english, 1996

10

Effects of rewards and punishments on leader charisma,leader effectiveness and follower reactions

Leanne E. Atwater, John F. Camobreco, Shelley D. Dionne, Bruce J. Avolio, Alan N. Lau

Journal:

The Leadership Quarterly

Year:

1997

Language:

english

File:

PDF, 1.53 MB

english, 1997

11

Filtering a Double Threshold Model With Regime Switching

Elliott, Robert J., Tak Kuen Siu,, Lau, John W.

Journal:

IEEE Transactions on Automatic Control

Year:

2013

Language:

english

File:

PDF, 1.30 MB

english, 2013

12

Disability, curriculum and integration in China

Lewis, John, Chong‐Lau, Stella, LO, Julianne Y.C.

Journal:

European Journal of Special Needs Education

Year:

1997

Language:

english

File:

PDF, 826 KB

english, 1997

13

Detection of the selective androgen receptor modulator andarine (S-4) in a routine equine blood doping control sample

Cawley, Adam T., Smart, Corrine, Greer, Candace, Liu Lau, Marcus, Keledjian, John

Journal:

Drug Testing and Analysis

Year:

2016

Language:

english

File:

PDF, 215 KB

english, 2016

14

Creep Analysis of Wafer Level Chip Scale Package (WLCSP) With 96.5Sn-3.5Ag and 100In Lead-Free Solder Joints and Microvia Build-Up Printed Circuit Board

Lau, John H., Pan, Stephen H., Chang, Chris

Journal:

Journal of Electronic Packaging

Year:

2002

Language:

english

File:

PDF, 391 KB

english, 2002

15

[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Reliability of Fan-Out Wafer-Level Packaging with Large Chips and Multiple Re-Distributed Layers

Lau, John, Li, Ming, Yang, Lei, Li, Margie, Yong, Qing Xiang, Cheng, Zhong, Chen, Tony, Xu, Iris, Fan, Nelson, Kuah, Eric, Li, Zhang, Tan, Kim Hwee, Cheung, Y. M., Ng, Eric, Lo, Penny, Kai, Wu, Hao, J

Year:

2018

Language:

english

File:

PDF, 1.23 MB

english, 2018

16

Assembly and Reliability of Lead-Free Solder Joints ||

Lau, John H., Lee, Ning-Cheng

Year:

2020

File:

PDF, 43.94 MB

2020

17

Challenges and trends in the determination of selected chemical contaminants and allergens in food

Rudolf Krska, Adam Becalski, Eric Braekevelt, Terry Koerner, Xu-Liang Cao, Robert Dabeka, Samuel Godefroy, Ben Lau, John Moisey, Dorothea F. K. Rawn, Peter M. Scott, Zhongwen Wang, Don Forsyth

Journal:

Analytical and Bioanalytical Chemistry

Year:

2012

Language:

english

File:

PDF, 1.03 MB

english, 2012

18

A Longitudinal Study of the Leadership Development Process: Individual Differences Predicting Leader Effectiveness

Leanne E. Atwater, Shelley D. Dionne, Bruce Avolio, John F. Camobreco, Alan W. Lau

Journal:

Human Relations

Year:

1999

Language:

english

File:

PDF, 165 KB

english, 1999

19

2012 Update of the Canadian Cardiovascular Society Guidelines for the Diagnosis and Treatment of Dyslipidemia for the Prevention of Cardiovascular Disease in the Adult

Anderson, Todd J., Grégoire, Jean, Hegele, Robert A., Couture, Patrick, Mancini, G.B. John, McPherson, Ruth, Francis, Gordon A., Poirier, Paul, Lau, David C., Grover, Steven, Genest, Jacques, Carpenti

Journal:

Canadian Journal of Cardiology

Year:

2013

Language:

english

File:

PDF, 1.01 MB

english, 2013

20

SPIE Proceedings [SPIE 1977 SPIE/SPSE Technical Symposium East - Reston (Monday 18 April 1977)] Stray Light Problems in Optical Systems - The Narcissus Effect In Infrared Optical Scanning Systems

Lau, Anthony S., Lytle, John D., Morrow, Howard E.

Year:

1977

Language:

english

File:

PDF, 196 KB

english, 1977

21

[American Institute of Aeronautics and Astronautics 17th AIAA International Space Planes and Hypersonic Systems and Technologies Conference - San Francisco, California ()] 17th AIAA International Space Planes and Hypersonic Systems and Technologies Conference - HIFiRE 4: A low-Cost Aerodynamics, Stability, and Control Hypersonic Flight Experiment

Smith, Thomas, Bowcutt, Kevin, Selmon, John, Miranda, Luis, Northrop, Brandin, Lau, Kei, Silvester, Todd, Mairs, Ron, Unger, Eric, Paull, Allan, Paull, Ross, Dolvin, Douglas, Alesi, Hans

Year:

2011

Language:

english

File:

PDF, 2.90 MB

english, 2011

22

Theta-burst transcranial magnetic stimulation to the prefrontal cortex impairs metacognitive visual awareness

Rounis, Elisabeth, Maniscalco, Brian, Rothwell, John C., Passingham, Richard E., Lau, Hakwan

Journal:

Cognitive Neuroscience

Year:

2010

Language:

english

File:

PDF, 612 KB

english, 2010

23

Bayesian Model-Based Clustering Procedures

John W. Lau and Peter J. Green

Journal:

Journal of Computational and Graphical Statistics

Year:

2007

Language:

english

File:

PDF, 2.31 MB

english, 2007

24

Injury Patterns and Help-seeking Behavior in Hong Kong Male Intimate Partner Violence Victims

Choi, Anna Wai-Man, Wong, Janet Yuen-Ha, Kam, Chak-Wah, Lau, Chu-Leung, Wong, John Kit-Shing, Lo, Ruby Tsz-Fung

Journal:

The Journal of Emergency Medicine

Year:

2015

Language:

english

File:

PDF, 180 KB

english, 2015

25

Rogers-Ramanujan Partitions: 10627

George E. Andrews, John Henry Steelman, G. L. Body, D. Callan, R. J. Chapman, K.-W. Lau, J. T. Lewis, J. H. Lindsey II, G. Lord, J. G. Merickel and Anchorage Math Solutions Group

Journal:

American Mathematical Monthly

Year:

2000

Language:

english

File:

PDF, 98 KB

english, 2000

26

Reliability of Fine Pitch Plastic Quad Flat Pack Leads and Solder Joints Under Bending, Twisting, and Thermal Conditions

Lau, John, Erasmus, Steve

Journal:

Journal of Electronic Packaging

Year:

1993

Language:

english

File:

PDF, 1.50 MB

english, 1993

27

Overview and outlook of through‐silicon via (TSV) and 3D integrations

Journal:

Microelectronics International

Year:

2011

Language:

english

File:

PDF, 636 KB

english, 2011

28

Solder Joint Reliability—Theory and Applications

Lau, John H., Engel, Peter A.

Journal:

Journal of Electronic Packaging

Year:

1992

Language:

english

File:

PDF, 154 KB

english, 1992

29

Solder Joint Reliability of Wafer Level Chip Scale Packages (WLCSP): A Time-Temperature-Dependent Creep Analysis

Lau, John H., Lee, S.-W. Ricky, Chang, Chris

Journal:

Journal of Electronic Packaging

Year:

2000

Language:

english

File:

PDF, 700 KB

english, 2000

30

Intimate partner violence victims' acceptance and refusal of on-site counseling in emergency departments: Predictors of help-seeking behavior explored through a 5-year medical chart review

Choi, Anna Wai-Man, Wong, Janet Yuen-Ha, Lo, Ruby Tsz-Fung, Chan, Pik-Ying, Wong, John Kit-Shing, Lau, Chu-Leung, Kam, Chak-Wah

Journal:

Preventive Medicine

Year:

2018

Language:

english

File:

PDF, 173 KB

english, 2018

31

Managing Officer Behavioural Risk Using Early Intervention Systems: Addressing System Design Challenges for Law Enforcement and Corrections Environments

Jackson, Brian A., Towe, Vivian Lau, Wagner, Lisa, Hunt, Priscillia, Greathouse, Sarah, Hollywood, John S.

Journal:

Year:

2016

Language:

english

File:

PDF, 201 KB

english, 2016

32

[IEEE 2018 International Wafer Level Packaging Conference (IWLPC) - San Jose, CA, USA (2018.10.23-2018.10.25)] 2018 International Wafer Level Packaging Conference (IWLPC) - Redistribution-Layers (RDLS) for Fan-Out Panel-Level Packaging

Year:

2018

Language:

english

File:

PDF, 804 KB

english, 2018

33

[IEEE 2019 China Semiconductor Technology International Conference (CSTIC) - Shanghai, China (2019.3.18-2019.3.19)] 2019 China Semiconductor Technology International Conference (CSTIC) - Redistribution-Layers for Fan-Out Wafer-Level Packaging and Heterogeneous Integrations

Year:

2019

Language:

english

File:

PDF, 40 KB

english, 2019

34

Structure and Mechanism of a Cyclic Trinucleotide-Activated Bacterial Endonuclease Mediating Bacteriophage Immunity

Lau, Rebecca K., Ye, Qiaozhen, Birkholz, Erica A., Berg, Kyle R., Patel, Lucas, Mathews, Ian T., Watrous, Jeramie D., Ego, Kaori, Whiteley, Aaron T., Lowey, Brianna, Mekalanos, John J., Kranzusch, Phi

Journal:

Year:

2020

Language:

english

File:

PDF, 4.55 MB

english, 2020

35

Bending and twisting of pipe with creep

Journal:

Nuclear Engineering and Design

Year:

1981

Language:

english

File:

PDF, 307 KB

english, 1981

36

Microbiology culture results in high risk foot clinic patients: an audit

Jessica M White, Lynne Toh, Hugh G Dickson, Erika N Koo, Gentry S Winters, Marion G Harpur, John Widdup, Namson S Lau

Journal:

Journal of Foot and Ankle Research

Year:

2011

Language:

english

File:

PDF, 163 KB

english, 2011

37

Clinical photography in a high risk foot clinic: a quality audit

Jessica M White, Hugh G Dickson, Erika N Koo, Gentry S Winters, Marion G Harpur, John Widdup, Namson S Lau

Journal:

Journal of Foot and Ankle Research

Year:

2011

Language:

english

File:

PDF, 165 KB

english, 2011

38

Process modeling: A systems engineering tool for analyzing complex systems

John S. Osmundson, Russell Gottfried, Chee Yang Kum, Lau Hui Boon, Lim Wei Lian, Poh Seng Wee Patrick, Tan Choo Thye

Journal:

Systems Engineering

Year:

2004

Language:

english

File:

PDF, 1.39 MB

english, 2004

39

Mechanisms of oxidative addition of organic halides to Group 8 transition-metal complexes

Stille, John K., Lau, Kreisler S. Y.

Journal:

Accounts of Chemical Research

Year:

1977

Language:

english

File:

PDF, 1.19 MB

english, 1977

40

Dimethyl sulfoxide (DMSO) produces widespread apoptosis in the developing central nervous system

Jennifer L. Hanslick, Karen Lau, Kevin K. Noguchi, John W. Olney, Charles F. Zorumski, Steven Mennerick, Nuri B. Farber

Journal:

Neurobiology of Disease

Year:

2009

Language:

english

File:

PDF, 2.16 MB

english, 2009

41

Summing up evidence: one answer is not always enough

Joseph Lau, John PA Ioannidis, Christopher H Schmid

Journal:

Year:

1998

Language:

english

File:

PDF, 81 KB

english, 1998

42

Validation of a Chinese achievement goal orientation questionnaire

Dr Kit-Ling. Lau, John C. K. Lee

Journal:

British Journal of Educational Psychology

Year:

2008

Language:

english

File:

PDF, 321 KB

english, 2008

43

Localised High-Density Activation Mapping of Dominant Frequency Sites during Atrial Fibrillation in Humans

P. De Sciscio, P. Kuklik, A.G. Brooks, M.K. Stiles, C.X. Wong, B. John, D.H. Lau, L. Wilson, G.D. Young, P. Sanders

Journal:

Heart Lung & Circulation

Year:

2009

Language:

english

File:

PDF, 72 KB

english, 2009

44

Effects of TSVs (through-silicon vias) on thermal performances of 3D IC integration system-in-package (SiP)

John H. Lau, Tang Gong Yue

Journal:

Microelectronics Reliability

Year:

2012

Language:

english

File:

PDF, 2.27 MB

english, 2012

45

The Distribution of Stock Returns: New Evidence against the Stable Model

Amy Hing-Ling Lau, Hon-Shiang Lau and John R. Wingender

Journal:

Journal of Business and Economic Statistics

Year:

1990

Language:

english

File:

PDF, 288 KB

english, 1990

46

[IEEE IECON 2010 - 36th Annual Conference of IEEE Industrial Electronics - Glendale, AZ, USA (2010.11.7-2010.11.10)] IECON 2010 - 36th Annual Conference on IEEE Industrial Electronics Society - Real Time Power Monitoring & integration with BIM

Alahmad, Mahmoud, Nader, Wisam, Neal, Jill, Shi, Jonathan, Berryman, Chuck, Cho, Y., Lau, Siu-Kit, Li, H., Schwer, Avery, Shen, Zhigang, Stansbury, John, Zhang, Tian

Year:

2010

Language:

english

File:

PDF, 961 KB

english, 2010

47

[IEEE 2008 10th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2008.12.9-2008.12.12)] 2008 10th Electronics Packaging Technology Conference - Reliability Results of 0.8 mil Fine Pitch Copper wire bonding on Immersion Gold Plated Pad for Copper Low-k Devices

Wai, Leong Ching, Zhang, Xiaowu, Kripesh, V., Premachandran, C. S., Chong, S.C., Liu, Ying Ying, Madhukumar, J., Srinivas, Vempati Rao, Thaw, PP, Jong, MJ, Lau, John H., Wang, Sandy, Foo, CK, Thew, ML

Year:

2008

Language:

english

File:

PDF, 5.84 MB

english, 2008

48

Lansoprazole for the Prevention of Recurrences of Ulcer Complications from Long-Term Low-Dose Aspirin Use

Lai, Kam Chuen, Lam, Shiu Kum, Chu, Kent Man, Wong, Benjamin C.Y., Hui, Wai Mo, Hu, Wayne H.C., Lau, George K.K., Wong, Wai Man, Yuen, Man Fung, Chan, Annie O.O., Lai, Ching Lung, Wong, John

Journal:

Boston Medical and Surgical Journal

Year:

2002

Language:

english

File:

PDF, 100 KB

english, 2002

49

On -amenability of Banach algebras

KANIUTH, EBERHARD, LAU, ANTHONY T., PYM, JOHN

Journal:

Mathematical Proceedings of the Cambridge Philosophical Society

Year:

2008

Language:

english

File:

PDF, 264 KB

english, 2008

50

Liraglutide 3.0 mg Reduces Body Weight and Improves Cardiometabolic Risk Factors in Adults with Overweight/Obesity: The SCALE Obesity and Prediabetes Randomised Trial

Lau, David C., Krempf, Michel, Astrup, Arne, Le Roux, Carel W., Fujioka, Ken, Greenway, Frank, Halpern, Alfredo, Ortiz, Rafael Violante, Wilding, John, Boras, Damir, Lilleøre, Søren Kruse, Pi-Sunyer,

Journal:

Canadian Journal of Diabetes

Year:

2015

Language:

english

File:

PDF, 94 KB

english, 2015